Seeed Studio XIAO ESP32C3

Seeed Studio XIAO ESP32C3 is equipped with a highly integrated ESP32-C3 chip built around a four-stage sequential 32-bit RISC-V core processor that can operate at up to 160 MHz.

The board features the ESP32-C3 SoC, which is highly integrated with a complete 2.4 GHz Wi-Fi subsystem, offering support for Station mode, SoftAP mode, SoftAP + Station mode, and a random mode, making it suitable for a variety of Wi-Fi applications. The chip operates in ultra-low power states and also supports Bluetooth 5 and Bluetooth mesh capabilities. The chip boasts 400 KB SRAM and 4 MB Flash, providing more programming space and expanding the possibilities for IoT control scenarios.

This board, a part of the Seeed Studio XIAO series, retains the classic thumb-sized form factor design and the elegant realization of single-sided component mounting. It is equipped with a battery charging chip and an integrated circuit to increase portability. The board comes with an external antenna to boost signal strength for wireless applications. It offers 11 digital I/O pins that can be used as PWM pins and 4 analog input/output pins that can be used as ADC pins. It supports UART, I2C, and SPI serial communication ports. With a small and elegant hardware design and a powerful built-in chip programmed by Arduino, it can provide more capabilities to wearable and portable devices and other applications.

Features

• Flexible MCU Board: Features the ESP32-C3 32-bit RISC-V chip, operates at up to 160 MHz, and is supported by Arduino and CircuitPython.
• Superior RF Performance: Supports complete Wi-Fi and Bluetooth Low Energy functions while achieving communication at distances of over 100 meters with a U.FL antenna.
• Detailed Power Design: Supports lithium battery charging management and provides four low-power operating modes, consuming as little as 44 μA in deep sleep mode.
• Thumb-Sized Design: 21 x 17.5 mm in size, it follows the classic form factor of the Seeed Studio XIAO series, suitable for wearable devices.
• Ideal for Production: Breadboard-friendly and SMD design with no components on the back.

Hardware Specifications