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a 165,5 mm x 54,5 mm x 8,5 mm solderless breadboard that has four bus lines each spanning the length of the board, and 63 rows of pins. Breadboard (830 Point) is enough for up to nine 14-pin DIP ICs or seven 16-pin DIP ICs. The rows and columns of tie points are labeled, and multiple units can be connected for larger projects.